@misc{Raskin_Jean-Pierre_Charge-pumping,
 author={Raskin, Jean-Pierre and Głuszko, Grzegorz and Łukasiak, Lidia and Olbrechts, Benoit and Kilchytska, Valeriya and Flandre, Denis and Chung, Tsung Ming},
 howpublished={online},
 publisher={Instytut Łączności - Państwowy Instytut Badawczy, Warszawa},
 language={ang},
 title={Charge-pumping characterization of SOI devices fabricated by means of wafer bonding over pre-patterned cavities, Journal of Telecommunications and Information Technology, 2007, nr 3},
 type={artykuł},
 keywords={SOI, Si layer transfer, wafer bonding, interface traps, electrical characterization, charge-pumping},
}