Title:

Understanding of wet and alternative particle removal processes in microelectronics: theoretical capabilities and limitations, Journal of Telecommunications and Information Technology, 2005, nr 1

Creator:

Tardif, Francois ; Danel, Adrien ; Raccurt, Olivier

Subject and Keywords:

particle removal ; cleaning ; SC1

Description:

A 2 orders of magnitude range of van der Waals interactions is considered here to take the majority of the variety of shapes and materials of actual particles into account. Comparing these interactions with the repulsive forces generated by electrostatic charges, drag, surface tension, shock waves, high accelerations and aerosol particles, the intrinsic capabilities and limitations of the different cleaning processes can be predicted. Three kinds of particle-removal processes have been identified { universal processes capable of removing all particle sizes and types, even from patterned wafers, processes that present the same theoretical ability but are actually limited by the accessibility of the particles, and finally cleanings that are not able to remove all particle sizes.

Publisher:

Instytut Łączności - Państwowy Instytut Badawczy, Warszawa

Date:

2005, nr 1

Resource Type:

artykuł

Format:

application/pdf

DOI:

10.26636/jtit.2005.1.297

ISSN:

1509-4553

eISSN:

1899-8852

Source:

Journal of Telecommunications and Information Technology

Language:

ang

Rights Management:

Biblioteka Naukowa Instytutu Łączności