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Tytuł: Enhancement of Air-groundMatching by Means of a Chirped MultilayerStructure: Electromagnetic Modelingwith the Method of Single Expression, Journal of Telecommunications and Information Technology, 2017, nr 3

Autor:

Marciniak, Marian ; Pajewski, Lara ; Knyazyan, Tamara ; Hovhannisyan, Tamara ; Baghdasaryan, Hovik

Data wydania:

2017, nr 3

Typ zasobu:

artykuł

Opis:

The enhancement of air-ground electromagneticmatching by means of a chirped multilayer structure is inves-tigated. The modeling and simulation of the considered struc-ture are performed by using the method of single expression(MSE), which is a convenient and accurate tool for wavelength-scale simulations of multilayers comprising lossy, amplifyingor nonlinear (Kerr-type) materials. Numerical results showthat a suitable chirped multilayer structure can reduce the re- ection from the ground. Different values of the number oflayers and of the layer thicknesses are considered. The distributions of the electric eld components and the power owdensity within the modelled structures are calculated.

Wydawca:

National Institute of Telecommunications

Format:

application/pdf

Identyfikator zasobu:

ISSN 1509-4553, on-line: ISSN 1899-8852 ; oai:bc.itl.waw.pl:1988

Źródło:

Journal of Telecommunications and Information Technology

Język:

ang

Prawa:

Biblioteka Naukowa Instytutu Łączności

Temat i słowa kluczowe:

method of single expression chirped multilayer structure ground matching

Kolekcje, do których przypisany jest obiekt:

Data ostatniej modyfikacji:

31 paź 2017

Data dodania obiektu:

31 paź 2017

Liczba wyświetleń treści obiektu:

76

Wszystkie dostępne wersje tego obiektu:

https://bc.itl.waw.pl/publication/2267

Wyświetl opis w formacie RDF:

RDF

Wyświetl opis w formacie OAI-PMH:

OAI-PMH

Nazwa wydania Data
Baghdasaryan, Hovik; Knyazyan, Tamara; Hovhannisyan, Tamara; Marciniak, Marian, Enhancement of Air-groundMatching by Means of a Chirped MultilayerStructure: Electromagnetic Modelingwith the Method of Single Expression, Journal of Telecommunications and Information Technology, 2017, nr 3 31 paź 2017

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