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Title: Piezoresistive sensors for atomic force microscopy – numerical simulations by means of virtual wafer fab, Journal of Telecommunications and Information Technology, 2001, nr 1

Creator:

Jakubowski, Andrzej ; Tomaszewski, Daniel ; Grabiec, Piotr ; Rangelow, Ivo W. ; Domański, Krzysztof ; Barth, Wolfgang ; Dębski, Tomasz

Date:

2001, nr 1

Resource Type:

artykuł

Description:

An important element in microelectronics is the comparison of the modelling and measurements results of the real semiconductor devices. Our paper describes the final results of numerical simulation of a micromechanical process sequence of the atomic force microscopy (AFM) sensors. They were obtained using the virtual wafer fab (VWF) software, which is used in the Institute of Electron Technology (IET). The technology mentioned above is used for fabrication of the AFM cantilevers, which has been designed for measurement and characterization of the surface roughness, the texturing, the grain size and the hardness. The simulation are very useful in manufacturing other microcantilever sensors.

Publisher:

Instytut Łączności - Państwowy Instytut Badawczy, Warszawa

Format:

application/pdf

Resource Identifier:

oai:bc.itl.waw.pl:684 ; ISSN 1509-4553, on-line: ISSN 1899-8852

DOI:

10.26636/jtit.2001.1.45

ISSN:

1509-4553

eISSN:

1899-8852

Source:

Journal of Telecommunications and Information Technology

Language:

ang

Rights Management:

Biblioteka Naukowa Instytutu Łączności

Subject and keywords:

technology characterization technology simulation atomic force microscopy piezoresistive sensors

Object collections:

Last modified:

May 20, 2024

In our library since:

Apr 26, 2010

Number of object content hits:

256

All available object's versions:

https://bc.itl.waw.pl/publication/760

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Edition name Date
Dębski, Tomasz; Barth, Wolfgang; Rangelow, Ivo W.; Domański, Krzysztof; Tomaszewski, Daniel; Grabiec, Piotr, Piezoresistive sensors for atomic force microscopy – numerical simulations by means of virtual wafer fab, Journal of Telecommunications and Information Technology, 2001, nr 1 May 20, 2024

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