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Search for: [Subject and Keywords = "characterization"]

Number of results: 10

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Characterization of SOI fabrication process using gated-diode measurements and TEM studies, Journal of Telecommunications and Information Technology, 2000, nr 3,4

Jakubowski, Andrzej Tomaszewski, Daniel Łukasiak, Lidia Gibki, Jan Ratajczak, Jacek Kątcki, Jerzy

2000, nr 3,4
artykuł
Simple method for characterization of photonic crystal fibers, Journal of Telecommunications and Information Technology, 2007, nr 2

Grabiec, Waldemar Pałka, Norbert Szustakowski, Mieczysław

2007, nr 2
artykuł
Piezoresistive sensors for atomic force microscopy – numerical simulations by means of virtual wafer fab, Journal of Telecommunications and Information Technology, 2001, nr 1

Jakubowski, Andrzej Tomaszewski, Daniel Grabiec, Piotr Rangelow, Ivo W. Domański, Krzysztof Barth, Wolfgang Dębski, Tomasz

2001, nr 1
artykuł
Characterization of SOI MOSFETs by means of charge-pumping, Journal of Telecommunications and Information Technology, 2007, nr 3

Głuszko, Grzegorz Łukasiak, Lidia Gottlob, Heinrich Lemme, Max Szostak, Sławomir

2007, nr 3
artykuł
Electrical characterization of ISFETs, Journal of Telecommunications and Information Technology, 2007, nr 3

Tomaszewski, Daniel Jaroszewicz, Bohdan Pijanowska, Dorota G. Grabiec, Piotr Zaborowski, Michał Yang, Chia-Ming

2007, nr 3
artykuł
Frequency Offset Compensation for OFDM Systems Using a Combined Autocorrelation and Wiener Filtering Scheme, Journal of Telecommunications and Information Technology, 2010, nr 1

Khanzada, Tariq Jamil Omar, Abbas Ali, Ali Ramadan

2010, nr 1
artykuł
Development of Data Processing Tools for the Analysis of Radargrams in Utility Detection Using Ground Penetrating Radar, Journal of Telecommunications and Information Technology, 2017, nr 3

Sagnard, Florence

2017, nr 3
artykuł
SOI Technology: An Opportunity for RF Designers?, Journal of Telecommunications and Information Technology, 2009, nr 4

Raskin, Jean-Pierre

2009, nr 4
artykuł
On-wafer wideband characterization: a powerful tool for improving the IC technologies, Journal of Telecommunications and Information Technology, 2007, nr 2

Raskin, Jean-Pierre Lederer, Dimitri

2007, nr 2
artykuł
Charge-pumping characterization of SOI devices fabricated by means of wafer bonding over pre-patterned cavities, Journal of Telecommunications and Information Technology, 2007, nr 3

Raskin, Jean-Pierre Głuszko, Grzegorz Łukasiak, Lidia Olbrechts, Benoit Kilchytska, Valeriya Flandre, Denis Chung, Tsung Ming

2007, nr 3
artykuł

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