Advanced search ?

Object

Download

Title: The Effect of High Temperature Annealing on Fluorine Distribution Profile and Electro-Physical Properties of Thin Gate Oxide Fluorinated by Silicon Dioxide RIE in CF4 Plasma, Journal of Telecommunications and Information Technology, 2010, nr 1

Creator:

Beck, Romuald B. ; Głuszko, Grzegorz ; Kalisz, Małgorzata

Date:

2010, nr 1

Resource Type:

artykuł

Description:

This study describes the effects of high temperature annealing performed on structures fluorinated during initial silicon dioxide reactive ion etching (RIE) process in CF4 plasma prior to the plasma enhanced chemical vapour deposition (PECVD) of the final oxide. The obtained results show that fluorine incorporated at the PECVD oxide/Si interface during RIE is very stable even at high temperatures. Application of fluorination and high temperature annealing during oxide layer fabrication significantly improved the properties of the interface (DitmDitmb decreased), as well as those of the bulk of the oxide layer (Qef f decreased). The integrity of the oxide (higher Vbd ) and its uniformity (Vbd distribution) are also improved.

Publisher:

Instytut Łączności - Państwowy Instytut Badawczy, Warszawa

Format:

application/pdf

Resource Identifier:

oai:bc.itl.waw.pl:766 ; ISSN 1509-4553, on-line: ISSN 1899-8852

DOI:

10.26636/jtit.2010.1.1059

ISSN:

1509-4553

eISSN:

1899-8852

Source:

Journal of Telecommunications and Information Technology

Language:

ang

Rights Management:

Biblioteka Naukowa Instytutu Łączności

Subject and keywords:

radio frequency reactive ion etching current-voltagecharacteristics capacitance-voltage characteristics fluorine plasma high temperature annealingprocess

Object collections:

Last modified:

Aug 28, 2024

In our library since:

Oct 5, 2010

Number of object content hits:

152

All available object's versions:

https://bc.itl.waw.pl/publication/850

Show description in RDF format:

RDF

Show description in OAI-PMH format:

OAI-PMH

Edition name Date
Kalisz, Małgorzata; Głuszko, Grzegorz; Beck, Romuald B.,The Effect of High Temperature Annealing on Fluorine Distribution Profile and Electro-Physical Properties of Thin Gate Oxide Fluorinated by Silicon Dioxide RIE in CF4 Plasma, Journal of Telecommunications and Information Technology, 2010, nr 1 Aug 28, 2024

Objects Similar
Novel Method of Improving Electrical Properties of Thin PECVD Oxide Films by Fluorination of Silicon Surface Region by RIE in RF CF4 Plasma, Journal of Telecommunications and Information Technology, 2010, nr 1

Beck, Romuald B. Głuszko, Grzegorz Kalisz, Małgorzata

2010, nr 1
artykuł
The role of fluorine-containing ultra-thin layer in controlling boron thermal diffusion into silicon, Journal of Telecommunications and Information Technology, 2007, nr 3

Beck, Romuald B. Ćwil, Michał Kalisz, Małgorzata Barcz, Adam

2007, nr 3
artykuł
Applying shallow nitrogen implantation from rf plasma for dual gate oxide technology, Journal of Telecommunications and Information Technology, 2007, nr 3

Jakubowski, Andrzej Beck, Romuald B. Ćwil, Michał Głuszko, Grzegorz Konarski, Piotr Bieniek, Tomasz

2007, nr 3
artykuł
The influence of annealing (900◦C) of ultra-thin PECVD silicon oxynitride layers, Journal of Telecommunications and Information Technology, 2007, nr 3

Jakubowski, Andrzej Beck, Romuald B. Ćwil, Michał Głuszko, Grzegorz Konarski, Piotr Schmeißer, Dieter Hoffmann, Patrick Mroczyński, Robert

2007, nr 3
artykuł
Ultrathin oxynitride films for CMOS technology, Journal of Telecommunications and Information Technology, 2004, nr 1

Jakubowski, Andrzej Beck, Romuald B.

2004, nr 1
artykuł
Oxidation kinetic sof silicon strained by silicon germanium, Journal of Telecommunications and Information Technology, 2007, nr 3

Beck, Romuald B. Grabowski, Jarosław

2007, nr 3
artykuł
Challenges in ultrathin oxide layers formation, Journal of Telecommunications and Information Technology, 2001, nr 1

Jakubowski, Andrzej Beck, Romuald B. Łukasiak, Lidia Korwin-Pawłowski, Michał

2001, nr 1
artykuł
Ultra-shallow nitrogen plasma implantation for ultra-thin silicon oxynitride (SiOxNy) layer formation, Journal of Telecommunications and Information Technology, 2005, nr 1

Jakubowski, Andrzej Beck, Romuald B. Bieniek, Tomasz Kudła, Andrzej

2005, nr 1
artykuł
More
×

Citation

Citation style:

Contact details

Address

Instytut Łączności – Państwowy Instytut Badawczy ul. Szachowa 1 04-894 Warszawa

Phone

(+48) 5128 696

E-Mail

biblioteka@il-pib.pl

Visit us!

This page uses 'cookies'. More information